Frame having frame blades that participate in cooling memory modules
US8767403B2 · kind B2 · utility
10Cited by
23References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2009 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Oct 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A frame has frame blades arranged to be interleaved with memory modules or memory module sockets. The frame blades participate in cooling the memory modules when memory modules are installed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.