Three dimensional passive multi-component structures
US8767408B2 · kind B2 · utility
2Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2012 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Aug 22, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.