Three-dimensional macro-chip including optical interconnects
US8768123B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2012 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Aug 3, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/12002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A multi-chip module (MCM) includes a stack of chips that are coupled using optical interconnects. On a first surface of a middle chip in the stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. The second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. An optical path associated with the second direction passes through an opening in a substrate in the middle chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.