Method of making conductive pattern
US8769805B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2010 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | Dec 23, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49224
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.