Packaged sensor with multiple sensors elements
US8770034B2 · kind B2 · utility
10Cited by
70References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2011 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | Dec 28, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclose relates to sensor including multiple sensor elements. In some cases, the multiple sensor elements may be mounted on a single substrate and each may be configured to sense a single parameter with different resolutions, sensitivities, and/or ranges, and/or the multiple parameters. In one example, multiple pressure sensing die may be mounted in a single package, and each may be configured as a differential pressure sensor, an absolute pressure sensor, and/or a gauge pressure sensor, as desired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.