Cutting wheel for glass substrate
US8770080B2 · kind B2 · utility
0Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2010 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | May 16, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A cutting device that facilitates a cutting operation of a glass substrate and reduces internal defects that can be caused by surface cracks. The cutting wheel includes a cutting blade formed along a circumference thereof with respect to a rotation axis, wherein first and second slopes of the cutting blade are formed in an asymmetrical shape about an edge of the cutting blade where the first and second slopes meet each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.