Method and apparatus for superposed application of shipping labels over packing slips
US8770626B2 · kind B2 · utility
0Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2010 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | Jul 8, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides a method and apparatus for applying shipping labels over both folded or non-folded packing slips, or the like, at a single print-and-apply station, either through use of a label configured for application to a substrate and also in a superposed registered manner to another label of identical construction previously attached to the substrate, or by using a shipping label having a non-aggressive adhesive applied to a removable center section of the shipping label for attachment of the packing list, or the like, to the shipping label prior to application of the shipping label to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.