Substrate processing apparatus
US8771420B2 · kind B2 · utility
2Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2010 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | Aug 19, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus that forms thin films on a plurality of substrates and thermally processes the substrates, by uniformly heating the substrates. The substrate processing apparatus includes a processing chamber, a boat in which substrates are stacked, an external heater located outside of the processing chamber, a feeder to move the boat into and out of the processing chamber, a lower heater located below the feeder, and a central heater located in the center of the boat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.