Patent · US Active

Method of encapsulating an electronic arrangement

US8771459B2 · kind B2 · utility

3Cited by

4References

21Claims

0Family size

Assignee

tesa SE · DE

Inventors

Klaus Keite-Telgenbüscher · Hamburg, DE
Jan Ellinger · Hamburg, DE
Thortsten Krawinkel · Hamburg, DE
Alexander Steen · Bonn, DE

Key dates

Filing date	May 6, 2010
Grant date	Jul 8, 2014
Priority date	—
Expiry date	Jul 16, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH10K2102/311
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.