Method of reducing temperature difference between a pair of substrates and fluid reaction device using the same
US8771610B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Oct 14, 2010 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | May 8, 2033 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2013/006
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A fluid reaction device includes a microfluidic reaction chip which accommodates a fluid, a heater, and a heat transfer facilitating layer which is interposed between the microfluidic reaction chip and the heater, the heat transfer facilitating layer has a higher thermal conductivity than air and can hold particles, wherein formation of an air layer can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.