Sealed chip package
US8772016B2 · kind B2 · utility
0Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2010 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | Apr 29, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24331
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The invention provides environmental packages, instruments, and methods for sealing, protecting, and providing analysis chips for processing and analysis. The analysis chips are bonded directly or indirectly to chip carriers which are held within the chambers of an environmental packaging strip. The chambers are sealed with a sealing film such that the chip carriers can be extracted using a piercing tool and an extraction tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.