Signal amplification by hierarchal resonating structures
US8772999B2 · kind B2 · utility
5Cited by
35References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 11, 2007 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | Jan 14, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/02488
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An electromechanical resonating structure, including: first level major elements coupled to each other to form a second or higher level hierarchy; and first level sub-micron size minor elements with a characteristic frequency and coupled to each of the first level major elements to form a second level hierarchy in which a signal is effectively amplified by vibrating each of the plurality of major elements in at least one mode determined by the geometry and dimensions of the first level sub-micron minor elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.