Light emitting device package, light source module, and lighting system including the same
US8773006B2 · kind B2 · utility
14Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2012 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | Aug 21, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a light emitting device package. The light emitting device includes a package body having a cavity defined by a sidewall and a bottom surface, a light emitting device disposed in the cavity, a radiator inserted into the package body and disposed below the light emitting device, and a second electrode pattern disposed around the radiator and electrically connected to the light emitting device via wire bonding. The second electrode pattern includes a first region to which a wire is bonded, and a second region connected to the first region, and a width of the first region differs from a width of the second region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.