Method of inspecting printed circuit board, method of manufacturing printed circuit board and inspection device of printed circuit board
US8773159B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2010 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | Oct 21, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A plurality of assembly sheets are placed on an upper surface of a substrate adsorption platform, and a pressing plate is placed on the plurality of assembly sheets placed on the substrate adsorption platform such that the plurality of assembly sheets are pressed by the pressing plate. In this state, a DC power supply device is turned on and causes the upper surface of the substrate adsorption platform to be charged, thereby causing the plurality of assembly sheets to be adsorbed on the upper surface by an electrostatic force. Then, the pressing plate placed on the plurality of assembly sheets is removed while the upper surface of the substrate adsorption platform is charged, and automatic appearance inspection is performed on the plurality of assembly sheets adsorbed on the upper surface of the substrate adsorption platform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.