Enclosure assembly housing at least one electronic board assembly and systems using same
US8773864B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2008 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | May 30, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1434
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various embodiments of the invention relate to enclosure assemblies housing at least one electronic board assembly and systems (e.g., missiles or unmanned vehicles) that may employ such enclosure assemblies. In an embodiment, an enclosure assembly includes an enclosure having an interior surface defining an interior space and an inner diameter. At least one electronic board assembly is positioned within the interior space and includes a first peripheral edge region and an opposing second peripheral edge region. The electronic board assembly extends diametrically so that the first and second peripheral edge regions are at least proximate to the interior surface. In another embodiment, a plurality of electronic board assemblies are positioned within the interior space and each extends generally along a respective non-diametric chord defined by the interior surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.