Speaker diaphragm, speaker dust cap, speaker frame, speaker using said parts, and electronic equipment and device using said speaker
US8774449B2 · kind B2 · utility
1Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 24, 2010 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | Dec 24, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/15
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Each of a speaker diaphragm, a dust cap, and a frame includes a resin and a plant opal that is extracted from a bamboo leaf, and is formed by injection molding or sheet molding. The configuration can enhance stiffness of each of the diaphragm, the dust cap, and the frame and implement high performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.