System and method for increasing die yield
US8775112B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2003 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | Dec 18, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention systems and methods facilitate increased die yields by flexibly changing the operational characteristics of functional components in an integrated circuit die. The present invention system and method enable integrated circuit chips with defective functional components to be salvaged. Defective functional components in the die are disabled in a manner that maintains the basic functionality of the chip. A chip is tested and a functional component configuration process is performed on the chip based upon results of the testing. If an indication of a defective functional component is received, the functional component is disabled. Workflow is diverted from disabled functional components to enabled functional components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.