Support device of three-dimensional integrated circuit and method thereof
US8775998B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2011 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | Nov 10, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To provide a design support device of a three-dimensional integrated circuit capable of, in the case where a placement position of a through-via changes in the design phase of a three-dimensional integrated circuit composed of a plurality of semiconductor chips in layers, avoiding change of respective placement positions of other parts as much as possible. A design support device includes a TSV placement unit that determines respective placement positions of through-vias on one semiconductor chip, the through-bias each penetrating to connect to another semiconductor chip, a TSV reserved cell placement unit that determines, based on the respective placement positions of the through-vias, respective placement positions of reserved cells as respective spare placement positions of the through-vias, and a mask data generation unit that generates layout data that includes the respective placement positions of the through-vias and the respective placement positions of the reserved cells.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.