Drying apparatus under reduced pressure for plastic molding material
US8776390B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2010 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Mar 15, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/131
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A drying apparatus under reduced pressure for a plastic molding material. The apparatus comprises a drying hopper provided with an airtight material charge valve capable of containing gas therein at its upper portion and a material discharge valve at its lower portion, and connected to a vacuum pump via vacuum piping, a heating means of thermal conduction type provided in the drying hopper, and a plastic material adherence preventing means in which a gas charge port connected to a gas tank storing gas via a gas changeover valve is provided between the material discharge valve and the drying hopper and stored gas is fed into the drying hopper by opening the gas changeover valve after predetermined time, thereby preventing adherence of plastic molding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.