Acceleration sensor, semiconductor device and method of manufacturing semiconductor device
US8776602B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2010 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Mar 1, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The acceleration sensor according to the present invention includes a circuit chip having a prescribed circuit built into a front surface thereof; a sensor chip bonded to the front surface of the circuit chip; and a resin package for sealing the circuit chip and the sensor chip, while the sensor chip includes: a membrane arranged to oppose to the front surface of the circuit chip and having a plurality of openings; a piezoresistor formed on a surface of the membrane opposed to the circuit chip; a support section provided on a side opposite to the circuit chip with respect to the membrane and supporting a peripheral edge portion of the membrane; and a weight section provided on the side opposite to the circuit chip with respect to the membrane and integrally held on a central portion of the membrane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.