Image-assisted system for adjusting a bonding tool
US8777086B2 · kind B2 · utility
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9References
10Claims
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Key dates
| Filing date | Apr 20, 2012 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Apr 20, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/78315
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonding tool is adjusted to a desired operational position by viewing the bonding tool with an image-capturing device and displaying an image of the bonding tool as viewed by the image-capturing device onto a display screen. A corresponding image of a reference bonding tool showing the desired operational position of the bonding tool is superimposed onto the display screen and the position of the bonding tool is adjusted with an adjustment mechanism until the bonding tool as viewed by the image-capturing device is aligned with the superimposed image of the reference bonding tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.