Patent · US Active

Method and apparatus for applying solder to a work piece

US8777087B2 · kind B2 · utility

1Cited by

7References

18Claims

0Family size

Assignee

SCHOTT SOLAR AG · DE

Inventors

Hilmar Von Campe · Bad Homburg vor der Höhe, DE
Stefan Meyer · Ronneburg, DE
Thai HUYNH-MINH · Hanau, DE
Stephan HUBER · Rechtmehring, DE
Silvio REIFF · Aschaffenburg, DE

Key dates

Filing date	Feb 23, 2011
Grant date	Jul 15, 2014
Priority date	—
Expiry date	Feb 23, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02E10/50
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature TL and subject to the influence of ultrasound. In order to be able to solder without difficulties the solder onto work pieces that exhibit sensitivity to breakage it is proposed that the solder is heated, is applied to the work piece that is supported in particular in a spring-mounted manner, and is soldered-on subject to the influence of ultrasound.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.