System and methods for forming stacks
US8777552B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2011 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Feb 28, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/114
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A method of forming layered stacks of bundles includes providing a gripping appliance comprising a first gripping assembly and a second gripping assembly. The first gripping assembly is configured for grasping one or more first bundles and the second gripping assembly is configured for grasping one or more second bundles. The first and second gripping assemblies are configured such that first and second bundles grasped thereby may be reoriented relative to one another. The method further includes retrieving from a first location one or more first bundles with the first gripping assembly and one or more second bundles with the second gripping assembly and transporting the first and second bundles to a second location, During transport of the first and second bundles, the bundles are reoriented relative to one another. The bundles are deposited at a selected position in the second location to form at least a partial layer of a layered stack of bundles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.