Patent · US Active

Method for laser-assisted bonding, substrates bonded in this manner and use thereof

US8778121B2 · kind B2 · utility

17Cited by

2References

23Claims

0Family size

Assignees

Fraunhofer-Gesellschaft zur der Andewandten · DE
Friedrich-Schiller-Universitat Jena · DE

Inventors

Andreas Tuennermann · Jena, DE
Ramona Eberhardt · Jena, DE
Gerhard Kalkowski · Jena, DE
Stefan Nolte · Jena, DE

Key dates

Filing date	Feb 21, 2008
Grant date	Jul 15, 2014
Priority date	—
Expiry date	Aug 24, 2030

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC04B2237/60
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

The present invention relates to a method for laser-assisted bonding of substrates, in which these are connected together firstly frictionally by pressing together and subsequently strengthening of the connection between the substrates is effected by activation in regions which is induced by laser irradiation. The invention likewise relates to substrates produced accordingly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.