CMP composition containing zirconia particles and method of use
US8778212B2 · kind B2 · utility
5Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2012 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | May 27, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a chemical-mechanical polishing composition containing zirconia particles, a modifying agent that adheres to the zirconia particles, an organic acid, and water, as well as a method of using such a polishing composition to polish substrates and a method of using a polishing composition comprising zirconia particles, an organic acid, an oxidizing agent, and water to polishing substrates containing metal and oxide-based dielectric materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.