Electronic device and method for manufacturing same
US8778469B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2012 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Sep 13, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/239
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
When local heating by use of laser sealing or the like is applied, the bonding strength between glass substrates and a sealing layer is improved to provide an electronic device having increased reliability. An electronic device includes a first glass substrate, a second glass substrate, and a sealing layer to seal an electronic element portion disposed between these glass substrates. The sealing layer is a layer obtained by locally heating a sealing material by an electromagnetic wave, such as laser light or infrared light, to melt-bond the sealing material, the sealing material containing sealing glass, a low-expansion filler and an electromagnetic wave absorber. In the first and second glass substrates, each reacted layer is produced to have a maximum depth of at least 30 nm from an interface with the sealing layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.