Method to provide microstructure for encapsulated high-brightness LED chips
US8778706B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2010 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Jun 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Encapsulated LEDs can be made by taking a mold tool defining a cavity that defines a lens shape and providing a patterned release film defining the inverse of a microstructure in a surface of the film. The patterned release film is conformed to the cavity of the mold tool. An LED chip is placed in a spaced relationship from the patterned release film in the cavity. A resin is then introduced into the space between the LED chip and the patterned release film in the cavity. The resin is cured in the space between the LED chip and the patterned release film in the cavity while contact is maintained between the patterned release film and the curing resin. The encapsulated LED is then freed from the mold tool and the patterned release film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.