Laser removal of conductive seed layers
US8778799B2 · kind B2 · utility
2Cited by
5References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 11, 2012 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Jan 16, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/172
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for making conductive traces and interconnects on a surface of a substrate includes, for an embodiment, forming a dielectric or polymer layer on the surface of the substrate, forming a seed layer of an electrically conductive material on the dielectric or polymer layer, patterning a photoresist on the seed layer, forming the conductive traces on the patterned photoresist and seed layer, removing the photoresist from the substrate, and irradiating the surface of the substrate with a fluence of laser light effective to ablate the seed layer from areas of the substrate surface exclusive of the conductive traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.