Epoxy resin compositions
US8779034B2 · kind B2 · utility
1Cited by
14References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2010 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Jan 3, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A low color epoxy resin composition comprising (a) an epoxy resin and (b) at least one an inorganic phosphorous-containing compound stabilizing agent, for example an additive such as sodium pyrophosphate dibasic (SPD) compound; wherein the resulting epoxy resin composition is storage stable and the epoxy resin composition exhibits a low color. The low color epoxy resin composition is used to prepare an epoxy encapsulant which is useful in light emitting diodes (LEDs).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.