Module molding touch module
US8779313B2 · kind B2 · utility
3Cited by
1References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 22, 2007 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Oct 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2229/044
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An in-mould molding touch module includes a flexible printed circuit having a touch control circuit, and a molding flexible film. The flexible film contains integratedly the flexible printed circuit by an in-mould injecting mode. The flexible film has an outer surface for touch control. The outer surface is configured for being pressed for driving the touch control circuit of the flexible printed circuit to output signals. Therefore, the present touch module is manufactured simply, and has a thin thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.