Patent · US Active

Integrated circuit including a porous material for retaining a liquid and manufacturing method thereof

US8779548B2 · kind B2 · utility

7Cited by

3References

20Claims

0Family size

Assignee

NXP B.V. · NL

Inventors

Youri Victorovitch Ponomarev · Leuven, BE
Aurelie Humbert · Brussels, BE
Roel Daamen · Herkenbosch, NL

Key dates

Filing date	Jul 26, 2010
Grant date	Jul 15, 2014
Priority date	—
Expiry date	May 18, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Disclosed is an integrated circuit (IC) comprising a substrate (10) including a plurality of circuit elements and a metallization stack (20) covering said substrate for providing interconnections between the circuit elements, wherein the top metallization layer of said stack carries a plurality of metal portions (30) embedded in an exposed porous material (40) for retaining a liquid, said porous material laterally separating said plurality of metal portions. An electronic device comprising such an IC and a method of manufacturing such an IC are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.