Solenoid control apparatus
US8780564B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 24, 2012 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Sep 20, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/87885
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A solenoid control apparatus includes a resin housing having a solenoid mounting portion, a connector portion, and a circuit board mounting portion in which a circuit board is mounted. Terminals extending from the solenoid mounting portion and the connector portion are soldered to the electrical circuit on the circuit board. The circuit board has a reduced-rigidity portion in its area corresponding to a portion of the resin housing through which the connector portion is connected to the solenoid mounting portion. The reduced-rigidity portion is formed by reducing the amount of material forming the circuit board per unit area, and is more easily deformable than the remaining portion of the circuit board. When the connector portion is thermally deformed, the circuit board is also easily deformable about the reduced-rigidity portion. This reduces stress on the soldered portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.