Detection of wafer-edge defects
US8781070B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2012 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Mar 9, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2223/646
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Apparatus for inspection of a disk, which includes a crystalline material and has first and second sides. The apparatus includes an X-ray source, which is configured to direct a beam of X-rays to impinge on an area of the first side of the disk. An X-ray detector is positioned to receive and form input images of the X-rays that are diffracted from the area of the first side of the disk in a reflective mode. A motion assembly is configured to rotate the disk relative to the X-ray source and detector so that the area scans over a circumferential path in proximity to an edge of the disk. A processor is configured to process the input images formed by the X-ray detector along the circumferential path so as to generate a composite output image indicative of defects along the edge of the disk.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.