Compact, highly integrated microphone assembly
US8781140B2 · kind B2 · utility
14Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2012 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Apr 13, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R19/005
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microelectromechanical (MEMS) microphone assembly includes a MEMS structure, a base portion, and a lid. The MEMS structure includes a diaphragm that responds to changes in sound pressure and the MEMS structure contributes to a vertical dimension of the assembly. The MEMS structure is supported by the base portion. The lid partially but not completely encloses the MEMS structure, such that the portion of the MEMS structure is not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.