Polycrystalline diamond cutting elements with engineered porosity and method for manufacturing such cutting elements
US8783389B2 · kind B2 · utility
16Cited by
172References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2010 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | May 26, 2031 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/567
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for facilitating infiltration of an infiltrant material into a TSP material during re-bonding of the TSP material to a substrate, by enhancing the porosity of the TSP material near the interface with the substrate is provided. Cutting elements formed by such method and downhole tools including such cutting elements are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.