LED packaging structure having improved thermal dissipation and mechanical strength
US8783911B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 17, 2012 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Mar 12, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8592
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present disclosure involves a lighting apparatus. The lighting apparatus includes a thermally-conductive substrate. The thermally-conductive substrate may include a substrate. The lighting apparatus also includes a printed circuit board (PCB). The PCB is located besides the thermally-conductive substrate. The PCB and the thermally-conductive substrate have different material compositions. The lighting apparatus also includes a photonic device located over the thermally-conductive substrate. The photonic device may include a light-emitting diode (LED) die. The photonic device is thermally coupled to the thermally-conductive substrate. The photonic device is electrically coupled to the printed circuit board. The lighting apparatus also includes a thermal dissipation structure. The thermal dissipation structure is thermally coupled to the thermally-conductive substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.