Spinal instrument for measuring load and position of load
US8784339B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2011 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Nov 22, 2031 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2310/00023
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A spinal instrument includes sensors for measuring a parameter of the muscular-skeletal system. The spinal instrument includes a sensored head region that can be inserted into a spinal region. The spinal instrument comprises a housing, a housing, an electronic assembly, and a flexible interconnect. Housing includes a handle portion, a shaft portion, and a support structure. Similarly, housing includes a handle portion, a shaft portion, and a support structure. Furthermore, housing has a cavity and a lengthwise passage respectively for receiving electronic assembly and flexible interconnect. A sensored head region of spinal instrument includes an assembly stack for measuring load magnitude and position of load on the support structure and the support structure. The flexible interconnect couples the electronic assembly to the sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.