Patent · US Active

Bonded abrasive article and method of forming

US8784521B2 · kind B2 · utility

1Cited by
22References
19Claims
0Family size

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Key dates

Filing dateDec 2, 2010
Grant dateJul 22, 2014
Priority date
Expiry dateMar 2, 2032

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC04B2235/365
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

An abrasive article includes an abrasive body having abrasive grains within a bond material, the abrasive body further including a spinel material disposed at an interface between the abrasive grains and the bond matrix.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.