Use of multi-layered structure for the manufacture of gas conducts, namely for methane
US8784526B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2013 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | May 2, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1393
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to the use of a multi-layered structure for the manufacture of gas conducts, namely for methane. The multi-layered structure comprises, from the inside to the outside, the following successive layers: a layer containing at least one polyamide, wherein the polyamide is chosen from PA11, PA12 and an aliphatic polyamide obtained from condensation reaction of an aliphatic diamine having 6 to 18 carbon atoms and an aliphatic diacid having 9 to 18 carbon atoms; optionally, a binding 2 layer; and a layer 3 chosen from an EVOH layer, a layer formed of a mixture of polyamide and a polyolefin with a polyamide matrix, a layer of PA6, Pa6-6, MXD.6 or MXD.10 and a layer of semi-aromatic copolyamide, the layer 3 being intended to be in contact with the transported gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.