Process for producing liquid ejection head
US8784591B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 6, 2013 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Feb 6, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1064
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A process for producing a liquid ejection head includes a provision step of providing a piezoelectric substrate, and a first and a second support substrate for supporting the piezoelectric substrate; a bonding step of bonding one surface of the first support substrate to one principal surface of two principal surfaces of the piezoelectric substrate; a groove forming step of forming a groove in the other principal surface of the two principal surfaces of the piezoelectric substrate; an electrode forming step of forming a first electrode on at least one surface of a lateral surface of the groove, a bottom surface of the groove and the other principal surface remaining after the groove is formed; a joining step of joining one surface of the second support substrate to the other principal surface of the piezoelectric substrate; and a separation step of separating the first support substrate from the piezoelectric substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.