Resin bonding method by photoirradiation, method for producing resin article, resin article produced by the same method, method for producing microchip, and microchip produced by the same method
US8784973B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2012 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Oct 20, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31909
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin bonding method according to the present invention is a resin bonding method for bonding a first resin and a second resin including (I) a step of irradiating spaces containing oxygen molecules with vacuum ultraviolet light having a wavelength of 175 nm or less, the spaces being in contact with surfaces of the first and second resins; and (II) a step of, after the irradiation, subjecting the surfaces to temperature rise while the surfaces are in contact with each other, to bond the first resin and the second resin together with the surfaces serving as bonding surfaces. In the step (I), the surfaces of the first and second resins may be further irradiated with the vacuum ultraviolet light. In this case, a light amount of the vacuum ultraviolet light having reached the surfaces is preferably, for example, 0.1 J/cm2 or more and 10 J/cm2 or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.