Spray coatable adhesive for bonding silicon dies to rigid substrates
US8785524B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2011 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Dec 13, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1645
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.