Glue for repair or attachment free of organotin
US8785537B2 · kind B2 · utility
9Cited by
0References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2010 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Apr 8, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2190/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to an adhesive composition, including: 10 to 95% of a moisture cross-linkable polymer (A), the main chain includes 2 silyl terminal groupings, each of which includes at least one hydrolyzable group bonded to the silicon atom; 1 to 60% of a mineral filler (B) in the form of particles having a size of between 1 nm and 0.2 mm; and 0.2 to 7% of a crosslinking catalyst (C) consisting of titanium tetraisopropoxide. The invention also relates to the use of said composition as glue for repair or attachment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.