Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof
US8785953B2 · kind B2 · utility
7Cited by
0References
22Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 23, 2012 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Mar 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0361
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.