Packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity
US8786073B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2012 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Nov 14, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/142
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.