Semiconductor package and method of forming
US8786084B2 · kind B2 · utility
1Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2010 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Mar 27, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a semiconductor die attached to a support having electrically conductive paths, the semiconductor die having a bond-pad electrically connected to the electrically a conductive path on the support by a bond-wire of a first metallic composition, the bond-wire and the bond-pad being coated with a protection layer of a second metallic composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.