Patent · US Active

Interconnect for an optoelectronic device

US8786095B2 · kind B2 · utility

18Cited by

28References

16Claims

0Family size

Assignee

SUNPOWER CORPORATION · US

Inventors

Ryan Linderman · Oakland, US
Keith Johnston · Palo Alto, US
Thomas Phu · Alameda, US
Matthew Dawson · Katy, US

Key dates

Filing date	Apr 1, 2013
Grant date	Jul 22, 2014
Priority date	—
Expiry date	Apr 1, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02E10/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Interconnects for optoelectronic devices are described. For example, an interconnect for an optoelectronic device includes an interconnect body having an inner surface, an outer surface, a first end, and a second end. A plurality of bond pads is coupled to the inner surface of the interconnect body, between the first and second ends. A stress relief feature is disposed in the interconnect body. The stress relief feature includes a slot disposed entirely within the interconnect body without extending through to the inner surface, without extending through to the outer surface, without extending through to the first end, and without extending through to the second end of the interconnect body.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.