Transformer structures for a power amplifier (PA)
US8786381B2 · kind B2 · utility
4Cited by
24References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 28, 2010 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | May 22, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2203/45731
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
In one embodiment, the present invention includes a transformer formed on a semiconductor die. Such transformer may have multiple coils, including first and second coils. Each coil may have segments that in turn are formed on a corresponding metal layer of the semiconductor die. The segments of a given coil are coupled to each other, and the first and second coils can be interdigitated with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.