Module cooling method and plenum adaptor
US8787020B2 · kind B2 · utility
0Cited by
3References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 7, 2012 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Dec 26, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for cooling modules in a radio system is disclosed. The apparatus comprises an adaptor module with side walls and integrated heat exchanging elements. The adaptor module adapts the air flow from a chassis in the radio system such that the exiting ducting on the chassis efficiently mate with the air conduits in the modules. The adaptor allows the use of new high power density modules in the existing chassis without changing the module design. The use of adaptor module in chassis provides efficient cooling and use less volume in the chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.