Memory cooler
US8787021B2 · kind B2 · utility
4Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2011 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Aug 17, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooler for a memory module includes heat plates on the sides of the memory module and heat fins extending from the top of the heat plates. The heat fins are optimized according to simulated or actual airflow about the memory module inside an enclosure. The heat fins may curve diagonally outward from the memory module and their free ends may be arranged substantially parallel to the airflow so air flows over their larger lateral surfaces down to the memory module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.